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By Hirakata, Hiroyuki; Kitamura, Takayuki; Shimada, Takahiro; Sumigawa, Takashi

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17 Schematic diagram showing the typical relationship between the SCC crack growth rate and the stress intensity factor. diffusing into the material concentrates on the region near stressconcentrated sites such as notches, inclusions, and precipitates, and this leads to cracking. The crack growth rate da/dt due to SCC is governed by environmental and mechanical factors. The mechanical factor is characterized by the stress intensity factor K . 17 shows the schematic relationship between da/dt and K , where the curve is divided into three regions: A, B, and C.

J* is, of course, the path-independent integral in a fully crept body. 2 Transition from SSC to LSC At the loading instant (t = 0), we have the elastic stress field (no creep effect) in the vicinity of the crack tip, Eq. 1, because creep is a time-dependent phenomenon. On the other hand, Eq. 21 shows the steady state under creep-dominated conditions after enough time has elapsed. This signifies that the stress field changes from an elastic condition (Eq. 1) to a creep condition (Eq. 21) after loading, as schematically illustrated in Fig.

And Hirakata, H. (2007) Stress field near interface edge of elastic-creep bi-material, Eng. Fract. , 74, pp. 1637–1648. , and Hirakata, H. (2008) Increase of stress intensity near interface edge of elastic-creep bi-material under a sustained load, Eng. Fract. , 75, pp. 1285–1293. Landes, J. , and Begley, J. A. (1976) A fracture mechanics approach to creep crack growth, ASTM STP 590, pp. 128–148. , and Salganik, R. (1965) The strength of adhesive joints using the theory of cracks, Int. J. Fract.

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